Research & Development
R&D Projects

Withstand and Capacity Enhancement for SiC Hybrid Modules

# Business Groups & Production Technology Groups # Semiconductors # Energy Saving

  • Reduction of generated loss (comparison with previous product: reduced by 31%)

  • Compatibility with existing packages

  • Adoption of SiC-SBDs manufactured at 6-inch line in the Matsumoto Factory

We have released to the market an SiC hybrid module , which combines SiC-SBD chips with Si-IGBT chips.

Compared with previous products, the newly developed SiC hybrid module has enhanced rated voltage capacity.

For example, a module with a capacity of 3300 V/1800 A achieves high efficiency inverter operation, while reducing generated loss by 31% compared with Si modules.

The hybrid module facilitates easy replacement with existing Si modules, and it is expected to expand the application range.

In the future, we plan to expand the usage of hybrid modules in other packages also.

External appearance (HPM)
Loss simulation results
Econo PIM is a trademark of Infineon Technologies AG, Germany.

Product lineup

Related products