May 24, 2016 - Fuji Electric Co., Ltd. (TSE:6504) (“FE”), headquartered in Tokyo, Japan, led by President Michihiro Kitazawa, is pleased to announce that it will start shipping samples of direct liquid cooling power modules for automotive applications as a new product in the company’s power semiconductor line.
* Insulated Gate Bipolar Transistor
The new Fuji Electric power modules are 50% smaller and 60% lighter than conventional products, which facilitates the vehicle design process while contributing to better fuel economy. The new modules also offer double the power density (electric energy per unit of volume) of existing products, making them a world-class technology.
1）Optimized cooling mechanism reduces size and weight
The new device uses a water-based cooling mechanism to cool the heat generated during the power conversion process. The position of the cooling fins, shape, and the water channels that flow through the interior cooling structure, and so on have been optimally designed for superior heat radiation performance, while the fins are now made out of aluminum material rather than copper. The result is a module that is both smaller and lighter weight.
2）Reduced surface area thanks to industry-first technology
Fuji Electric has developed the first automotive grade reverse-conducting IGBT semiconductor device that has monolithic integration of an IGBT and FWD* regions, and applying this device has allowed us to reduce the module footprint size.
* Free Wheel Diode