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Next-generation Solder Material with High-temperature Resistance and High-reliability

  • Business Groups & Production Technology Groups
  • Production Technologies
  • Energy Saving
  • Safety and Security
  • Heat resistance of 200°C (previously 125°C)
  • High strength (125% stronger)
  • Improved solder wettability (120% improvement)

Mounting technology which realizes part miniaturization and high-temperature operation, as well as high quality and reliability has seen increasing demand with the advent of technologies such as electric vehicles and 5G communications.

In addition to existing developed lead-free solder alloys, Fuji has developed a new high-reliability solder alloy, for which it has obtained patents both in Japan and overseas. This technology is used for applications such as PCB and device bonding, contributing to improved reliability for a variety of products.

Changed to material strengthening mechanism while maintaining solder material flexibility.

High-temperature fatigue life test results (200°C)