In order to control high voltage, while maintaining low loss, we are developing a technology to improve electric insulation.
For example, we are solving problems that occur when utilizing practical applications of laminated bus bars (insulation coating conductor parts for connecting multiple semiconductor packages and capacitors at the shortest possible distance and at the lowest as possible inductance).
We have applied this technology to SiC packages with high withstand voltages to reduce the sizes of inverters.
Visualization of weakness via three-dimensional electric field computation (feed forward)
Verifying the limit performance by experiment