News Release
Starting Shipment of Samples of the 7th-Generation X Series IGBT Modules

August 5,2015
Fuji Electric Co., Ltd.

 August 5, 2015 - Fuji Electric Co., Ltd. (TSE:6504) (“FE”), headquartered in Tokyo, Japan, led by President Michihiro Kitazawa, is pleased to announce that it will start shipping samples of the 7th-generation X Series IGBT*1 modules in August as a new product line of power semiconductors.


: Insulated-gate bipolar transistor


 IGBT modules are mounted on industrial equipment such as inverters for driving motors, uninterruptible power systems (UPSs), and power conditioners for wind or photovoltaic power generation facilities, and are a key device in achieving both energy conservation and a stable electric power supply. The market size is estimated to amount to about 426.2 billion yen in 2016 and, from then on, is expected to grow at an annual rate of 6.0% (source: WSTS).
 Recently, as energy demand is growing globally, energy saving is increasingly required for industrial equipment in various fields. In production sites such as factories, there is strong demand for size/footprint reduction and high reliability of facilities/equipment.
 This series of modules is a new product line that meets these needs. Samples of the 1200V products will start shipment at first, and the lineups will continue to expand to include 650V and 1700V products..

2.Product Features

(1) Reduces power dissipation to contribute to energy conservation

 The IGBT and diode devices that constitute these modules have been made thinner and miniaturized, thereby optimizing the device structure. This has successfully reduced power dissipation in inverter operation compared with conventional products (Fuji Electric's 6th-generation V Series), contributing to energy saving and power cost reduction of the equipment on which the module is installed.

(2) Achieves equipment size reduction

 A newly developed insulating substrate has been applied in order to improve the module’s heat dissipation. Combined with the feature described above (reduced power dissipation) to suppress heat generation, an approximately 36%*2 reduction has been achieved in comparison to the conventional module. In addition, the maximum temperature guaranteed in continuous operation has been increased from the conventional 150°C to 175°C, which allows the output current to be increased by up to 35%*3 while maintaining the size of the equipment on which the module is installed. This contributes to reducing the size and total cost of the equipment.


: Mounting area ratio with 1,200 V 75A PIM models


: Value estimated from simulation results

1,200 V 75 A PIM model
1,200 V 75 A PIM model

(3) Contributes to improving equipment reliability

 The structure and materials of the module have been reworked to increase its stability and durability in high-temperature operation. This contributes to improving the stability and reliability of the equipment on which the module is installed.

3.Product Specifications


: Each sample schedule shall be different, please ask delivery time/date for sales referrals as below.

4.Product Specifications

 Japan: Sales Department 1, Semiconductor Division, Sales Group, Fuji Electric Co., Ltd., Japan
 Telephone: +81-3-5435-7152
 United States of America: Semiconductor Department, Fuji Electric Corp. of America, U.S.A
 Telephone: +1-732-560-9410
 Europe: Power Semiconductor Division, Fuji Electric Europe GmbH, Germany
 Telephone: +49(0)69-66 90 29 0
 China: Semiconductor Sales Department, Semiconductor Sales Headquarters, Fuji Electric China Co., Ltd, P.R.C
 Telephone: +86-21-5496-1177
 Asia: Semiconductor Sales Division, Fuji Electric Asia Pacific. Pte. Ltd., Singapore
 Telephone: +65 65330014

Reference: Lineup and Major Specifications

PIM: Power Integrated Module. Multiple circuits integrated into one module.
EconoPIMTM, EconoPACKTM, and PrimePACKTM are registered trademarks of Infineon Technologies AG.