Fuji Electric posesses process technology for Si-gate CMOS, bipolar-linear transistors, Bi-CMOS, and DMOS, and gold and solder bump technology for high-density mounting. The IC products are characterized by high breakdown voltage and high current, multifunctions realized by integration of analog and digital circuits and unification of sensors and logic. Their applications include information processing devices such as thermal heads and various displays, auto-focus cameras, power supply units and automobile applications. The paper also refers to prospects for its future IC technology.

This paper mainly introduces high-voltage technology and multilayer metal technology from among Fuji Electric's CMOSIC technology. The feature of the high-voltage technology is that the high-voltage output stage can be built in without changing the conventional CMOS process. It is suitable for thermal head drivers and LCD drivers. The multilayer metal technology is characterized by double layer Al metallization which realizes 1.5um space planerization by the SOG method.

Fuji Electric has developed a high-performance Bi-CMOSIC technology which realizes a "system on a chip"and high-speed performance. The feature of the process is that it can produce (1) floating capacitors, less dependent upon voltage, (2) high-speed NPN transistors, with a doped polysilicon emitter. In the field of circuit technology, we have developed a fully parallel A-D converter in which comparator offset voltage was reduced and accuracy was improved using a Bi-CMOS.

This paper introduces an outline of high-voltage DMOSIC technology, one of Fuji Electric's characteristic technologies. Particularly described are the processes and device characteristics of 400-V class DMOSIC technology using a double-epitaxial technique, field-plate technology, high-current technology using a stripe source and high-voltage NPN transistors using the DMOS process. In addition, a flat panel display driver IC is referred to as an example of application.

This paper describes an outline of Fuji Electric's CAD systems for LSI design and development. The CAD systems support the whole LSI development covering process and design simulation, electronic and logic circuit simulation, mask layout design, and verification.
Aiming at efficient development of more complicated LSIs with more advanced functions, higher grade CAD systems such as function level design and cell-based design automation technology are under development.

Bump technology is one of Fuji Electric's characteristic technologies. This paper outlines the features and processes of mounting technology such as solder bumping, gold bumping, and packageing. Some examples of bump mounting applications are included. Electronic components can be made more reliable and smaller by bare chip mounting, more reliable by solder bumps, and smaller by gold bumps.

This paper introduces the line-up of types, principle, and architecture of our AFICs used for auto-focus cameras.The IC is of a passive type which acquires information for auto-focus by projecting an object image on the two photosensor arrays and processing the image signals. The photosensor arrays, quantizing unit, and processing unit are integrated on a chip. The quantizing unit counts sensor response time with clock signals of a special type. The features are (1) compact, (2) measurable ranges unlimited, and (3) compatible with high-magnification zoom lenses.

Thermal head printers have come to be of smaller size and higher density with the spread of facsimile. To cope with the situation, Fuji Electric has successfully reduced the size of the driver ICs, the main component.
This paper introduces the features, circuit operation, and electrical characteristics of the two types newly developed and put on the market from among Fuji Electric's ICs for thermal head drivers.

Liquid crystal display (LCD) devices are expected to be the most promising electronic display because they have superior points such as small size, light weight, thin shape, and low power consumption.
This paper outlines integrated circuits each for the following three groups of LCD panels classified according to their uses:
(1)Controller drivers for small simple-matrix LCD panels,
(2)Drivers for large simple-matrix LCD panels,
(3)Drivers for active-matrix LCD paenels.

The use of MOSFETs in the field of switching power supply has increased with the use of a higher switching frequency. To cope with the situation, Fuji Electric has developed an IC for switching power supply controllers using a MOSFET. Though this IC is of an 8-pin package, it incorporates many functions and is very useful to make power supply unit smaller, more multi-functional, and cheaper.
This paper gives an outline of the development, mainly about its internal circuit and application circuits.

This paper describes the interface IC for high-voltage, large-current applications using Bi-CMOS which was accomplished by Fuji Electric's characteristic IC process technology.
The IC is connected to the 8-bit data bus of various microcomputers operating at 5 V DC and it can directly drive electronic control components operating at 24 V DC such as control relays, electronic counters, LEDs, etc. The IC is now under mass production to be applied to the electronic control circuits of Fuji Electric's automatic vendors, one of its main products.

Electrophotographic light printers has come into the market rapidly in recent years as output devices for personal computers and word processors because their high-quality, high-speed, low-noise printing attracted public attention.
To cope with the situation, Fuji Electric has developed and put on the market an integrated circuit for the head driver of LED printers, a kind of light printers. This paper gives an outline of its functions and characteristics.