This paper describes the technical trends of semiconductor-integrated devices based on power devices, such as monolithic intelligent power devices, power modules, power hybrid ICs. Power transistors, power MOSFETs, IGBTs-these devices have rapidly been enhanced in functions and variety. Technical innovation in device design, semiconductor processing, and package materials are also remarkable. Those technologies combined result in development of more integrated, more intelligent, smaller and lighter devices.

Fuji Electric has developed an intelligent power MOSFET switch for automobiles. The high-side switch of 60 V, 3 A is inocorporated in the fully molded TO-220 5-pin package. It has protection circuits against overheat, overcurrent and overvoltage, an open-load detection circuit, and an status-output function on a single chip, and has a level-shift driver to realize direct drive by a microcomputer. The -11V reverse-voltage clamping makes it possible to turn off inductive loads very fast, and surge protection indispensable for automotive applications is remarkably enhanced. One-chip construction by the self-isolation CMOS/DMOS process has achieved reduction in cost.

Fuji Electric has developed a new series of power rectifier diode modules which is intended to use in power-electronics products, sucn as general-purpose inverters, NC machine tools, robots, and welding machine. Smaller size and lighter weight has been achieved by adopting insulated aluminum boards, chip design considering an inrush current into the smoothing capacitor, and improved design for the diffusion profile and passivation. Also higher power-cycle reliability and temperature-cycle reliability have been realized by direct molding of epoxy resin and improvement of copper base shape for chips.

Fuji Electric has developed a new integrated power module for inverters of air conditioners. Its main built-in devices are a 2-pack diode bridge for the voltage doubler of 100-V AC supply, a 6-pack power transistor for the inverter, and a temperature detecting sensor. The new module construction has realized a thin, compact package. In addition, the shape and arrangement of the terminals are designed with full consideration of application to inverters of air conditioners.

It was thought difficult to put intelligent modules over 30 A into practice because there was some difficulty in making a compact drive circuit with a large base current. Fuji Electric has recently developed new technologies for high-h_FE transistors and others, and succeeded in manufacturing intelligent modules of 500 V/30 A, 50 A, and 75 A for inverters. The module incorporates seven transistors and fast recovery diodes, their drive circuits, reverse base bias circuits, optoisolates, over current protection, overheat protection and selfdiagnosis functions.

In recent years, IGBTs have popularly been used in electronic power converters. In addition to existing base driver hybrid ICs for bipolar transistors, Fuji Electric has developed a gate driver hybrid IC to drive an IGBT at the optimum performance. The use of this hybrid IC has realized IGBT drive at a high switching speed, and protects IGBTs from a overcurrent due to a short circuit.

Mostly switching power supplies have been used for the power supply of small-sized electronic instruments because of their merits of high efficiency, small size and light weight. Further, these are progressing toward smaller, lighter, and also high-frequency, high-performance switching supplies. To meet these requirements of supplies, Fuji Electric has developed power hybrid ICs which have such a unified construction that a main switch element MOSFET and control circuit are mounted on a good heat-conductive metal board and which facilitate configuration of medium-capacity switching supplies up to 250 W.

A portable electronic instrument powered by batteries or an AC adapter requires a small-size DC-DC converter to get the DC voltage to be used in the instrument. The requirement for smaller size and lighter weight has recently become stronger. To cope with the situation, Fuji Electric has developed a new a small-size DC-DC converter, where a conventional circuit board and shielding case eliminated, all the circuit parts are built in the magnetic material of the reactor, and the pattern is directly made on the magnetic material to form circuits.

The semiconductor pressure sensor, making good use of the piezoresistive effect of silicon, has made progress in integration and cost reduction with progress in semiconductor processing technology and micromachining technology and has come to wide use in automobiles, home appliances, industrial processes, and medical instruments. Fuji Electric has developed and is making a series of the pressure sensors, and a quad operational amplifier integrated on one chip. The paper introduces an outline and applications of the sensors.

In the electronics industry, improvement in the size, weight, and multifunction of electronic equipment is continued and surface mounting technology to mount high-density electronic parts automatically at high speed is widely used in household and industrial appliances; then, the development and commercialization of surface mounting semiconductor devices is strongly expected.
Fuji Electric has developed and commercialized various devices satisfying these market needs. This paper introduces them mainly concentrating on small-power diodes.

The papermaking industry is establishing and increasing production facilities to meet recent demand growth and diversified needs for quality. Fuji Electric has received an order from a certain papermaking factory and delivered an EIC-unified, centralized supervisory control system for automation of a coating preparation plant. The system is applied in the process for mixing and making up coatings for paper surfaces in fine-quality paper production, and includes UPOS for the data-base function and centralized supervision and operation of the plant and MICREX-F for PID control and sequential control.