This paper gives an outline of Fuji Electric's activities on integrated circuits. The company aims at developing custom IC's mainly in the field of information industry on the basis of its characteristic technology. They are distinguished by high-voltage CMOS process withstanding 30-220V, high-density bump technology consisting of solder bump and gold bump, sensor-integrated IC technology realizing multiple functions by incorporating a sensor function on a chip, and so on.

This paper introduces Fuji Electric's wafer process technology for bipolar IC's. The processes are classified into two types of 8μm rule characterized by high-current output and high voltage, and 4μm rule characterized by high frequency and high density. These processes can be selected suitably to meet the requirements of IC's to satisfy various market needs.

This paper introduces an outline of silicon-gate CMOS process technology from among Fuji Electric's custom IC technologies. Particularly, described are the features, process flows, and device characteristics of 6μm CMOS technology having realized about 40V breakdown voltage, bump application, and a built-in photo-sensor system, as well as of Fuji Electric's original 2μm CMOS process technology.

Fuji Electric has developed a 2μm rule bipolar CMOS process to realize high speed of IC's and integration of analog and digital functions.
The features of the process technology are (1)adoption of double metal and single polycrystalline silicon interconnection and (2)simplification of the process on the basis of silicon gate CMOS. This process has achieved high density and high breakdown voltage, guaranteeing 18V supply voltage at bipolar part and 7V operation at logic part. Further the shape of devices has been optimized to obtain high performance characteristics.

Fuji Electric has developed high-voltage DMOSIC technology to realize high performance and low cost of electrical devices controlling high voltage and large current. This technology is the integration of a silicon-gate CMOS of 5V logic part, double-diffused MOSFET, and npn transistor; its actual application, example, is a flat panel display driver IC.
In addition, a 450V blocking voltage device is now under development, and we are finding new applications while enhancing the process.

It is strongly required to shorten the ASIC design turnaround time though complexities in the design are rapidly increasing. This paper outlines Fuji Electric's cell-based design automation technology to solve the above problems. The cell-based design is more flexible and efficient than a conventional master-slice system like gate arrays and it can handle a large circuit like RAM's, ROM's, and other reusable circuit blocks as a single cell. Fuji Electric's system can support the whole design phases of ASIC's from schematic entry to automatic layout. Now the company is developing large functional cells to structure advanced total automation systems.

Simulation technology for semiconductors is now indispensable to the quick, accurate analysis of phenomena in processes, devices, and circuits in modern LSI development. Making good use of simulators will bring efficient development such as optimum design, marginal performance prediction, development time decrease, and development cost reduction.
This paper describes the trend of Fuji Electric's simulation technology, the functions and physical models of process, device, and circuit simulators and parameter extract programs, and an example of comprehensive simulation of a n-type MOSFET from process structure through model parameters.

One of Fuji Electric's characteristic technologies is bump technology. This paper outlines the features and processes of the mounting technology based on the bump technology such as solder bumping, gold bumping, and packaging, and introduces some products using these processes.

This paper describes the basic concept of the quality assurance of IC's in four stages of new product planning, development, design, and delivery, and details two important items in it. The one is the failure analysis and failure mechanism of IC's, illustrated by a failure analysis flow chart, a list of IC failure modes and causes, and their typical photos. The other is how to analyze and classify a vast quantity of various data in exact and simple forms and to feed back to the source to maintain and improve quality reliability, explained in detail with an example of improvement utilizing multiple regression analysis.

This paper describes the architecture, principle, process, and performance of the autofocus IC's for compact cameras and high-grade cameras under mass production or development.
These IC's are of a passive system utilizing reflecting beams from objects, and the photosensor, quantizing unit, processing unit are integrated on a chip by 2μm rule CMOS technology. They have the following features: (1) Compact, (2) Low-voltage operation, (3) Low current consumption, (4) No limitation of measurable ranges, (5) Available to systems with interchangeable lenses or zooming functions.

Since liquid crystal display devices have the features such as light weight, compactness, low power consumption, and also availability of CMOS drivers, they have widely been used in various fields as well as information and office automation devices, and has attracted the most attention among electronic display devices.
This paper gives an outline of the function and characteristic of simple matrix addressing IC's developed by applying CMOS process technology and bump technology from among Fuji Electric's IC's for liquid crystal display.

Plasama display is discharge in a gas mainly composed of neon emitting orange light. Since the display is easy to see and small in size, its wide use is expected in future. Driving the display requires high-voltage, large-current IC's. For the purpose of increasing power, Fuji Electric developed a high-voltage process, and has applied it to the production of IC's for DC and AC plasma display drivers and put them on the market. This paper describes the features and main characteristics of these IC's.

The control IC's for power supplies of various portable electronic devices eagerly require low operating voltage, low power consumption, and reduction of peripheral components, which were difficult to be met by conventional general-purpose control IC's.
To cope with the situation, Fuji Electric has developed a series of small-power DC-DC converter control IC's. This paper introduces the line-up, internal circuits, and features of these IC's. In addition, it refers to the basic configuration of various DC-DC converter circuits and precautions in using them, together with a brief description of application examples of the series.

This paper introduces the IC for electronic volume with the function of volume display. This IC needs a small number of external components and is best suited particularly to small-size TV's such as liquid crystal TV's. The main features are: (1) 16step volume selection and display on the screen by up/down input, (2) Low consumption current by CMOS application, (3) Built-in timer function for display on the screen, (4) Built-in preset function for switching on power supply, (5) Small size due to SOP16 (Small Outline Package).