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FUJI ELECTRIC JOURNAL 1998 Vol.71-No.2
Present Status and Prospects for Power Modules
Kenya Sakurai
The trend of research and development of semiconductors boils down to loss reduction, freedom from destruction, and system integration. The ceaseless technical innovation of semiconductors has greatly helped systems with semiconductor applications improve performance and functions and reduce size and cost. These systems are expected to further develop with modules incorporating system functions. This paper describes power modules and their technological features.
R-Series IGBT-IPMs for Large and Medium Power Drive
Atsushi Yamaguchi, Hiroaki Ichikawa, Shin Soyano
This paper describes the R series of IPMs and its new functions. The series ranges up to 600 V/300 A and 1,200 V/150 A with a 6-pack or 7-pack module first in the market and can fully meet requirements for large power drive. The built-in function in addition to the conventional protective function is overheat protection by directly detecting the IGBT temperature, which attains the high reliability of IPMs. The integrated circuit for the control circuit realizes reduction in size and cost.
Low-Power IGBT-IPM Modules for Home Appliances
Tamao Kajiwara, Takeshi Iwaida, Kazunori Oyabe
Fuji Electric has developed novel intelligent power modules (IPMs) for home appliances to meet market demands toward inverter application. The features are (1)multi-chip IPMs by developing and optimizing specific ICs (2)overheat protection by detecting the temperature of IGBT chip junctions (3)application of novel low-loss 4th-generation IGBT chips (4)highly accurate overcurrent protection by shunt resistance detection (5)low leakage current through the isolation layer by applying DBC insulation substrates.
NPT-IGBT Modules for Industrial Small and Medium Power Drive
Osamu Nakajima, Shuji Miyashita, Takeshi Iwaida
IGBTs, power devices characteristic of low loss and high-speed switching, have been wider used for power converters such as inverters to attain small size and weight, high efficiency, and low noise. Fuji Electric applied NPT-IGBTs to 1,200 V/1,400 V IGBTs and developed high-voltage, high-reliability modules. This paper describes IGBT modules newly developed with NPT-IGBT for small and medium power drive.
High-power NPT-IGBT Modules for Industrial and Traction Inverters
Hiromu Takubo, Kenichi Ishii, Souichi Okita
The performance of high-power converters for industrial and traction drive has made rapid progress with power device development. The mainstream of high-power devices was GTO thyristor. However, as IGBT technology for high voltage and power had developed, IGBT modules have noticeably been used for high-power equipment. This paper describes trends of high-power converters and Fuji Electric's attitude for power devices for high-power drive. It also introduces an outline of new high-power NPT-IGBT modules of 1-pack 1,200 V or 1,400 V/600 A and 1-pack 1,800 V/600 A (chopper) and their technological development.
High-Power Flatpack IGBTs for Traction and Industrial Use
Masami Ichijo, Yasukazu Seki, Takashi Nishimura
Fuji Electric developed 2,500 V/1,800 A press-pack IGBTs (type:EMB1802RM-25) and installed them in main converters for a prototype of the 700-series Shinkansen electric trains of Central Japan Railway Co. These IGBTs have been improved in size and performance compared with the former 1,000 A EMB1001RM-25. Fuji Electric is promoting improvement and development to raise cost performance, which is scheduled to complete this spring.
Technologies for Power Module Chips
Seiji Momota, Yasuhiko Ohnishi, Naoki Kumagai
The performance of chips is so important that it determines the characteristics of power modules. Fuji Electric developed IGBTs characteristic of high power and voltage drive, and in planar devices, it attained development of 4th-generation chips improved in performance to the maximum. Also it succeeded in developing the control IC for intelligent power modules. This paper outlines chip design technology to attain the characteristics as well as simulation analysis and processing technology required in the process.
Packaging Technology for High-Reliability Power Modules
Akira Morozumi, Rikihiro Maruyama, Katsumi Yamada
As social concern for the protection of global environment increases, clean electric energy is again noticed and power converters with higher efficiency are desired. Power modules, the key devices, require higher functions, performance, and reliability, and especially reliability is the most important basic quality. This paper describes packaging technology for power modules, focusing on the reliability of insulation, citing ceramic substrates which are the key parts controlling insulation and thermal characteristics.
Simulation Technology for Power Device
Manabu Takei, Masahito Otsuki
Semiconductor simulation can predict characteristics of a device without trial manufacture and is expected to shorten time required to develop power modules. The development of computer technology and advancement of simulation software have raised simulator speed and can execute calculation for power devices combined with a complicated external circuit. This paper introduces an example of IPM analysis.
