News Release
Fuji Electric and Semikron Team Up in the Power Semiconductor Field

November 21,2008
Fuji Electric Device Technology Co., Ltd.

Fuji Electric Device Technology Co., Ltd., (FDT, headed by President Hisao Shigekane and headquartered in Tokyo) and Semikron International GmbH (Semikron, headed by CEO Dirk Heidenreich and headquartered in Nurnberg, Germany) have signed an agreement for mutual supply of IGBT semiconductor chips and diode chips. The both companies have also agreed that FDT will manufacture and sell power modules employing spring contact technology under license from Semikron.

1.Outline of Agreements

2.Objectives of Cooperation

FDT is a leading global manufacture of power semiconductor components with the third largest market share of approximately 30% in the global market for IGBT modules for industrial drives. Semikron is the leader for diodes and thyristor modules with an approximately 40% market share and an expert in packaging technology for power semiconductor modules.

Under this cooperation, the two companies will build a basis for mutual supply of power semiconductor chips. The new freewheeling diode and rectifier diode chips from Semikron will allow FDT to enhance its product portfolio to offer customers an optimum combination of chips and modules that meets market needs for energy-saving and noise reduction. Also, by sharing the same spring contact technology, FDT and Semikron will be able to supply solder-free modules, which have been increasingly demanded by the market since the RoHS directive took effect and due to its lower manufacturing cost. This will enable the both companies to increase the market penetration for industrial drives, power supplies and home appliances. This matches the second source policy of customers, as well. According to the FDT’s estimate, the spring contact module market is about a \25 billion business worldwide. FDT aims to win 10% of the market by 2011.

3.Features of Spring Contact

Spring contacts allow for electrical connection without the use of solders. By using this technology, insulating substrates and a radiator can be easily screwed onto the module. No solders means no aging in solder joints. Spring contacts are therefore highly resistant to shock, vibration and corrosion and boast excellent thermal cycling properties, even in harsh ambient conditions.

4.Product Availability

IGBT modules with spring contacts are scheduled to be mass-produced in the fourth quarter of fiscal 2009 and marketed through our distributors.

Customer Inquiry:

Power Module Dept.
Semiconductor Business Div.
Fuji Electric Device Technology Co., Ltd.
Tel. +81-263-26-2513
Fax. +81-263-28-5531